Process Engineer (Wire Bond)

Responsibilities Develop new and improve existing gold, silver, and copper wire bonding process capability, stability, and quality Ensure wire bonding process meets customer's specifications and requirements Conduct failure analysis to identity root cause of wire bonding failures and find solutions to prevent future failure Co-ordinate NPI and NPQ activities to meet given timeline Qualify new product, material, device, and machinery Participate in new tape development, and new material development activities Perform supplier sourcing and qualification activities jointly with purchasing and engineering team Benchmark new materials and new equipment technology in the market Train co-workers on new process implementation and new machinery operations Maintain, troubleshoot, and perform minor repair of assembly and test machinery Develop new and update existing Standard Operating Procedures Participate in internal audits, customers' audits and external audits Comply with all quality, environmental, health, safety, and security policies and procedures of the Company Requirements Degree or Diploma in Material Science / Electronics Engineering Minimum 2-3 years working experience in a manufacturing environment (preferably in Semiconductor assembly and test environment / OSAT) Experience in operating ESEC, ASM, KNS wire bonders using Gold, Silver, and Copper wires Knowledgeable in the material science of bonding wires (gold, silver, copper), encapsulant epoxy, and structural substrates. Module knowledge in IC assembly processes such as die attach, wire bond, encapsulation, and testing Good team player, able to work independently, resourceful, willing to learn new skills, and has initiatives Knowledge in FMEA, SPC, OCAP, DOE, ISO9001:2000, ISO14001:2004, QEMS, CQM, JEDEC Good in problem solving, excellent interpersonal and communication skill

GMP Technologies (S) Pte Ltd | EA License 11C3793 | EA Personnel: Novita Widjaja | Registration No: R22105960