Responsibilities and Qualifications
Lead cross-functional semiconductor development programs from architecture and planning through silicon release.
Schedule, coordinate, and track resources, milestones, dependencies, and risks to ensure timely execution of projects.
Coordinate execution and design reviews across Analog Design, Digital Design, Verification, Layout, Physical Design, CAD, Validation, and Applications teams.
Drive regular program reviews with engineering leadership and executive management, including clear status and decision tracking.
Identify technical and schedule risks early and work with stakeholders to define practical mitigation plans.
Partner with engineering managers to balance priorities, staffing requirements, and program deliverables.
Develop and maintain productive working relationships with partners, engineering teams, and leadership stakeholders distributed across global sites and time zones.
Interface with customers, vendors, and internal stakeholders for specific programs and project commitments as needed.
Improve project execution processes, planning methods, communication practices, and program tracking metrics.
Support adoption and disciplined use of project management tools such as Jira, Structure, Microsoft Project, Smartsheet, or similar systems.
BS/MS in Electrical Engineering, Computer Engineering, or a related technical discipline.
8+ years of semiconductor industry experience.
Minimum 2 years of hands-on IC design experience (Analog, Mixed-Signal, Digital, Verification, Physical Design, Layout, or Systems Engineering), including at least one complete ASIC, SoC, or IP development cycle through silicon tapeout in a technical engineering role.
3+ years of Technical Program Management, Engineering Program Management, or closely related project leadership experience for semiconductor development programs.
Strong understanding of the full semiconductor development lifecycle — from specification and architecture through RTL, synthesis, design, verification, physical implementation, timing closure, layout integration, tapeout, silicon validation, and production release.
Strong technical problem-solving skills, including risk assessment, root cause analysis, and decision support in a fast-paced engineering environment.
Excellent communication, organization, stakeholder management, influencing, and negotiation skills.
Experience managing Analog/Mixed-Signal IP, high-speed data converter, or SoC development programs