Senior SMT PCBA Manufacturing / Process Engineer

Jabil

Senior SMT PCBA Manufacturing / Process Engineer

The Senior SMT PCBA Manufacturing / Process Engineer is responsible for developing, optimizing, and sustaining Surface Mount Technology (SMT) and Printed Circuit Board Assembly (PCBA) manufacturing processes to achieve world-class performance in quality, cost, delivery, and productivity. The role provides technical leadership for NPI, process validation, yield improvement, equipment qualification, automation initiatives, and continuous improvement projects while supporting high-volume production and customer requirements.

Key Responsibilities

1. Process Engineering & Manufacturing Support

• Own SMT and PCBA manufacturing processes from stencil printing through reflow, AOI, SPI, selective soldering, wave soldering, depanelization, coating, and final assembly.
• Develop and maintain process flows, control plans, PFMEA, work instructions, and process specifications.
• Lead process troubleshooting and root cause investigations for manufacturing issues.
• Drive yield, throughput, and cycle-time improvement initiatives.
• Establish process controls to ensure stable and repeatable production performance.
• Monitor process capability (Cp/Cpk) and implement corrective actions when required.

1. New Product Introduction (NPI)

• Lead DFM and DFA reviews during product development.
• Support manufacturing readiness activities for new product introduction.
• Define manufacturing process requirements, tooling, fixtures, and equipment.
• Lead pilot builds, engineering builds, and production ramp-up activities.
• Develop manufacturing documentation and train production personnel.
• Manage product transfer activities between sites or customers.

3 . SMT Process Optimization

• Optimize the following process areas: solder paste printing, placement processes, reflow profiles, AOI inspection programs, SPI inspection strategies, selective soldering parameters, and wave soldering parameters.
• Establish process windows and operating limits.
• Improve first-pass yield and reduce defect opportunities.
• Analyze defect trends and implement sustainable corrective actions.

1. Equipment & Automation

• Lead equipment selection, qualification, installation, and commissioning.
• Support SMT printers, pick-and-place machines, reflow ovens, SPI systems, AOI systems, X-Ray systems, and selective soldering equipment.
• Develop and implement automation solutions to improve productivity.
• Support Industry 4.0 manufacturing initiatives and digitalization programs.

1. Quality & Validation

• Lead IQ, OQ, PQ, Process Validation, and Test Method Validation activities.
• Perform Gauge R&R, MSA, SPC, and process capability studies.
• Review and update PFMEA, Control Plans, and Risk Assessments.
• Support customer, ISO, and regulatory audits.
• Ensure compliance with IPC standards and customer requirements.

1. Continuous Improvement

• Lead Lean Manufacturing initiatives.
• Facilitate DMAIC projects, Kaizen events, Value Stream Mapping, and OEE improvement projects.
• Drive cost reduction through yield improvement, labor optimization, material savings, automation, and cycle-time reduction.
• Establish KPI dashboards and performance monitoring systems.

1. Technical Leadership

• Mentor Process Engineers and Manufacturing Engineers.
• Provide technical coaching to technicians and production teams.
• Lead cross-functional problem-solving activities.
• Interface directly with customers regarding technical challenges and improvement initiatives.
• Lead engineering reviews and manufacturing readiness assessments.

Technical Requirements

SMT & PCBA Expertise

Strong technical knowledge of:

• SMT process development
• Stencil design and solder paste technology
• Pick-and-place programming
• Reflow profiling and optimization
• AOI and SPI systems
• X-Ray inspection techniques
• Wave soldering
• Selective soldering
• PCB defect analysis
• Conformal coating processes
• PCBA assembly technologies

Engineering Tools

Proficiency in:

• SPC and Minitab
• DMAIC and Lean Six Sigma
• PFMEA, Process Flow Diagrams, and Control Plans
• 8D Methodology, Fishbone Analysis, and 5 Why Analysis
• Time Study and Capacity Analysis
• AutoCAD (preferred)
• MES and manufacturing systems

Quality & Compliance

Strong understanding of:

• IPC-A-610
• IPC J-STD-001
• IPC-7711/7721
• ISO 9001
• ISO 13485 (preferred)
• FDA 21 CFR Part 820 (preferred)
• ESD control programs
• Change control systems
• CAPA processes

Education & Experience

Education

• Bachelor's Degree in Electronics, Electrical, Manufacturing, Mechanical, Industrial Engineering, or a related engineering discipline.

Minimum Experience

• 8+ years of SMT/PCBA manufacturing engineering experience.
• Minimum 5 years supporting high-volume SMT production.
• Experience with NPI, process validation, and yield improvement.

Preferred Experience

• 10+ years in electronics manufacturing services (EMS).
• Experience in a major EMS or equivalent high-mix electronics manufacturing environment.
• Lean Six Sigma Green Belt or Black Belt certification.
• Experience leading manufacturing transfer projects and multi-site deployments.

Key Performance Indicators

• First Pass Yield (FPY)
• Defect Rate (DPMO/PPM)
• OEE Improvement
• SMT Placement Efficiency
• Reflow Yield
• Cost Reduction Achievement
• Cycle Time Reduction
• NPI Ramp Success
• Corrective Action Closure
• Customer Quality Performance
• Equipment Utilization