Semicon Equipment Engineer (Pre Assembly)

Responsibilities:

• Operate,maintain, troubleshoot, and optimize die attach, wafer saw, backgrinding,Laser groove ,tape mount, or die sorting equipment
• Performpreventive and corrective maintenance to ensure equipment uptime andreliability.
• Supportequipment installation, qualification, ramp-up, and process improvement.
• Troubleshootmechanical, electrical, pneumatic, vacuum, and automation issues.
• Analyzeequipment failures and implement corrective actions.
• Workwith Process, Production, Quality, and vendors to resolve equipment issues.
• Maintainequipment documentation, SOPs, and maintenance records.

Requirements:

• Diploma/Degreein Mechanical, Electrical, Electronics, Mechatronics, or related field.
• Experiencein semiconductor manufacturing/equipment engineering preferred
• Equipmentexperience in die attach, wafer saw,backgrinding, Laser groove ,tape mount, or die sorting equipment
• Goodtroubleshooting, analytical, and problem-solving skills.
• Willingto work in a cleanroom and shift environment.

AllSuccessful candidates can expect a very competitive remuneration package and acomprehensive range of benefits.

Pleaseemail your resume in a detailed MS Word format to joyce@peopleprofilers.comstating

1)Current Drawn 2)Expecting Salary 3)Date Available 4)Reason to Leave each job:

Weregret that only shortlisted candidates will be notified

JoyceKoh Ai Leng PeopleProfilers Pte Ltd 20Cecil St, #08-09, PLUS Building, Singapore 049705 Tel:6950 9737 www.peopleprofilers.com EALicense Number: 02C4944 EAPersonnel Reg nos : R1110618 JobID:JOB-01078