Senior/Manager, Technical Program Management

Manage new design, qualification and post-sales technical requirements across semiconductor legacy and advanced packaging, including wafer bump, wafer-level CSP, assembly and test. Lead projects across the organisation's technology capabilities and facilities, working closely with Sales, FAE leaders, customers and factory operations. This role combines technical expertise, customer engagement, business development and end-to-end NPI project management.

Key responsibilities

• Understand and respond to customer technical queries, collaborating with the appropriate internal teams to address business and technical requirements.
• Present technical and service offerings, technology roadmaps and advanced packaging capabilities to customers.
• Organise and chair quarterly technical review meetings, including agenda development, materials preparation, customer invitations and follow-up of action items.
• Organise and prepare factories for customer engineering visits.
• Engage customers on next-generation packaging technology development projects and drive projects to successful completion with factory teams.
• Analyse customer product and technology roadmaps to identify new design wins and provide input to the corporate technology roadmap.
• Work with Sales and factory teams to provide technical support for RFQ responses.
• Drive NPI engagement between customers and factories and identify opportunities with engineering and procurement stakeholders.
• Submit design requests for new customer designs to the design centre and resolve technical issues arising from design risk assessments.
• Coordinate and manage design reviews and approvals between customers and factories.
• Manage the NRE process, ensure cost inputs are delivered to Sales, and follow up on quotation release and purchase orders for each project.
• Review build requests with customers and ensure alignment with factories on technical requirements.
• Develop and maintain project schedules for NPI projects and drive internal teams to execute to schedule.
• Support strategic wins, market growth, revenue, margin, roadmap updates, customer presentations, strategic planning, capital expenditure planning and annual operating plan planning.

What we're looking for

• A bachelor's degree or equivalent in engineering or a related discipline; a master's degree or above is advantageous.
• At least 5 years of semiconductor OSAT industry test and assembly experience or related industry experience.
• Typically 8 years of related experience with a bachelor's degree, 6 years with a master's degree, or 4 years with a PhD, or equivalent experience.
• Broad expertise in semiconductor packaging technology, including wideband, flip chip, wafer-level packaging, wafer bump and test.
• Good understanding of package design tools and mechanical, thermal and electrical simulation work.
• Proven people and project management experience, with strong customer interface skills and a record of achieving project engineering deadlines.
• Excellent programme management, verbal communication and written communication skills in English.
• French and Mandarin language skills are highly advantageous.
• Self-motivated and self-directed, with the ability to multitask, prioritise and manage time effectively in diverse work environments.
• Proficient computer skills, including Microsoft Word, PowerPoint, Outlook and Excel.