PROCESS ENGINEER

Description for Candidates To serve as the technical expert in transfer molding processes by driving process optimization, improving product quality, and ensuring stable and efficient production performance. The role is responsible for troubleshooting complex molding issues, supporting new product introduction, and implementing continuous improvement initiatives.

Qualifications/Requirements: Qualifications for Candidates

Must be either graduate in the field of BS in Mechanical or Electronics & Communications or Chemical Engineering, or equivalent. More than 10 years of experience in molding process. Proven hands-on experience with transfer molding equipment (e.g., TOWA, FUSEI) Strong knowledge of Epoxy Molding Compound (EMC), including material properties and processing behavior Extensive familiarity with semiconductor package molding processes, including transfer molding, IC encapsulation, and discrete/power device packaging Demonstrated expertise in troubleshooting complex molding issues and driving process optimization to improve yield, quality, and cycle time Strong analytical and problem-solving capabilities with a data-driven approach Effective communication and collaboration skills, with the ability to work across cross-functional teams