R&D Senior / Engineers

R&D - Lithography R&D - Underfill / Cure R&D - Plating, PR Strip, Wet Etch R&D - CA & TCB Responsibilities: To design, qualify, and optimize advanced processes that meet strict design rules and high-density packaging requirements, ensuring stable, cost-effective, and scalable technology delivery according to the technology roadmap. Lead assigned projects. Yield Improvement & Yield Failure Analysis (FA) Technology Qualification & Transfer Equipment & Material Evaluation Requirements: Bachelor’s degree or higher in engineering disciplines such as Materials Science, Mechanical Engineering, Chemical Engineering, Electronics, or Advanced Materials R&D or mass production experience of at least three years in processes Proficiency in data analysis tools (e.g., JMP, MATLAB, Excel) Strong analytical and problem-solving skills Strong skills in experimental design (DoE), failure analysis (FA), and technical data reporting Experience in customer-driven development programs, customer qualification, and technical issue resolution for semiconductor packaging solutions.