Sales FAE Engineer / Senior Sales FAE Engineer / Principal Sales FAE Engineer

ADVINNO TECHNOLOGIES PTE. LTD.Singaporemycareersfuturepaskelbta 2026-09-29
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Sales FAE Engineer / Senior Sales FAE Engineer / Principal Sales FAE Engineer

Department: Technical Sales

Location: Singapore (with regional travel across ASEAN, India, Greater China)

Reporting To: Technical Sales Director / Head of Sales

Position Overview

Advinno Technologies is seeking a highly motivated and customer-focused Sales FAE Engineer to drive business growth in semiconductor manufacturing services, including Foundry, OSAT, Advanced Packaging, IC Design Services, Photonics, and EDA Solutions.

The successful candidate will serve as the technical bridge between customers and our ecosystem partners, supporting customers from initial engagement through quotation, project execution, tapeout, assembly, testing, and production ramp-up.

Depending on experience, candidates may be hired at Engineer, Senior Engineer, or Principal Engineer level.

Key Responsibilities

Business Development & Sales Support

Drive revenue growth for:

  • Semiconductor Foundry Services
  • OSAT & Advanced Packaging Services
  • Wafer Fabrication Services
  • IC Design & Layout Services
  • Photonics IC Services
  • EDA Software Solutions
  • Substrate Design & Manufacturing Services

Identify and develop new business opportunities with:

  • Fabless semiconductor companies
  • Research institutes
  • Universities
  • IDMs
  • Startups
  • Government agencies
  • Build and maintain customer relationships across engineering, procurement, and management teams.
  • Generate and manage sales pipeline, forecasts, and opportunities in CRM systems.
  • Support preparation of quotations, proposals, Statements of Work (SOW), and commercial negotiations.

Technical FAE Responsibilities

Understand customer technical requirements and convert them into executable solutions.

Provide technical guidance on:

  • Process node selection
  • MPW and shuttle programs
  • Wafer fabrication flows
  • Packaging technology selection
  • Reliability requirements
  • Yield optimization
  • Product qualification

Coordinate with external partners including:

  • Foundries
  • OSATs
  • Design service providers
  • IP vendors
  • EDA suppliers
  • Conduct technical presentations, workshops, and solution demonstrations.
  • Support customer design review meetings and engineering discussions.

Project & Program Management

Follow opportunities from RFQ through PO closure.

Coordinate project schedules among customers, foundries, OSATs, and internal stakeholders.

Monitor project milestones including:

  • Design completion
  • Tapeout readiness
  • Mask ordering
  • Wafer fabrication
  • Package assembly
  • Reliability testing
  • Production release
  • Manage customer expectations and resolve technical or commercial issues.

Market Development

Track semiconductor industry trends in:

  • AI hardware
  • Automotive electronics
  • Power management ICs
  • RF and mixed-signal ICs
  • Silicon Photonics
  • MEMS
  • Compound Semiconductors

Support participation in:

  • Industry conferences
  • Technical seminars
  • University collaborations
  • Customer workshops
  • Trade exhibitions

Engineer Level Requirements

Education

Bachelor's Degree in:

  • Electrical Engineering
  • Electronics Engineering
  • Semiconductor Engineering
  • Photonics Engineering
  • Physics or equivalent

Experience

2 to 5 years experience in one or more areas:

  • Foundry services
  • IC design
  • Product engineering
  • Packaging
  • Semiconductor manufacturing
  • Technical sales
  • Applications engineering

Preferred Skills

  • Understanding of semiconductor manufacturing flow.
  • Basic knowledge of wafer fabrication and assembly processes.
  • Strong communication and presentation skills.
  • Ability to engage customers independently.

Senior Sales FAE Engineer Requirements

Experience

5 to 10 years semiconductor industry experience.

Additional Competencies

  • Established customer network within semiconductor ecosystem.
  • Ability to independently close opportunities.
  • Experience with:
  • Foundry account management
  • Tapeout management
  • Customer qualification activities
  • OSAT engagement

Preferred Knowledge

One or more of the following:

  • TSMC
  • GlobalFoundries
  • Tower Semiconductor
  • X-FAB
  • UMC
  • SMIC
  • Amkor
  • ASE
  • JCET
  • Stats ChipPAC

Principal Sales FAE Engineer Requirements

Experience

10+ years semiconductor industry experience.

Leadership Expectations

  • Drive strategic customer engagements.
  • Build regional business plans.
  • Mentor junior sales and FAE team members.
  • Lead complex multi-million-dollar opportunities.

Domain Expertise

Strong expertise in several of the following:

  • Advanced packaging
  • Chiplet integration
  • Heterogeneous integration
  • Silicon photonics
  • RF technologies
  • Automotive semiconductor qualification
  • Power semiconductor manufacturing
  • Wafer-level packaging
  • High performance computing and AI semiconductor solutions

Required Competencies

Technical

  • Semiconductor manufacturing flow
  • IC development lifecycle
  • Foundry business models
  • Packaging technologies
  • Yield and reliability concepts
  • Design-to-production methodologies

Commercial

  • Account management
  • Opportunity qualification
  • Negotiation skills
  • Revenue forecasting
  • Proposal preparation
  • Customer relationship management

Personal Attributes

  • Self-driven and entrepreneurial mindset
  • Strong customer focus
  • Excellent communication skills
  • Team player
  • Result-oriented
  • Comfortable working in a fast-growing technology company

Key Performance Indicators (KPIs)

  • Annual sales revenue achievement
  • Gross margin achievement
  • New customer acquisition
  • Opportunity pipeline value
  • Proposal-to-order conversion rate
  • Customer satisfaction
  • Number of technical engagements conducted
  • Strategic account growth

Why Join Advinno Technologies?

  • Exposure to leading semiconductor foundries and OSATs worldwide.
  • Opportunity to work with AI, Photonics, Advanced Packaging, and Next-Generation IC technologies.
  • Regional business development opportunities across ASEAN, India, China, Europe, and North America.
  • High-growth environment with strong career advancement opportunities.

Salary Range: Competitive base salary + sales incentive + performance bonus + travel allowance (based on experience and level).