Director, Laser Technology

Key Responsibilities Own the technical roadmap for high-power laser systems, beam shaping optics, and ultrafast laser slicing for diamond wafers.

Lead and scale a high-performing team of photonics engineers, optical physicists, and laser process specialists.

Drive the scaling and transfer of laser-material processing recipes (dicing, singulation, surface ablation) from R&D to the factory floor.

Partner with Equipment Engineering to design, procure, and integrate high-precision optical delivery hardware and galvo systems.

Maximize diamond wafer yield by resolving complex laser-material interaction excursions, thermal lens effects, and beam drift

Collaborate with Metrology and Automation teams to implement real-time optical sensor grids and closed-loop process controls.

Qualifications & Experience Master’s or Ph.D. in Optics, Photonics, Physics, Electrical Engineering, or Materials Science.

8+ years in laser systems engineering, with 5+ years managing technical optical/process engineering teams.

Deep technical expertise in high-power industrial lasers (fiber, DPSS, ultrafast/femtosecond), beam delivery optics, and galvo scanners.

Proven track record in precision laser-material processing loops (e.g., semiconductor wafer slicing, ceramic/hard-material dicing, or optical annealing).

Proficiency with optical simulation tools (Zemax, Code V) and multiphysics modeling platforms (COMSOL, MATLAB, Python).

Strong background in Statistical Process Control (SPC), Design of Experiments (DOE), and Root Cause Analysis (RCA).