Process Engineer

Mesh Optical Technologies· Gardena, CA· greenhouse· objavljeno 17. 02. 2026.

PROCESS ENGINEER

Mesh Optical Technologies was founded on the belief that optical photons will be at the center of advanced technologies in the coming century. Making advanced technology ubiquitous means building at scale, and that’s exactly what we’re doing at Mesh.

Keeping our production tools running and our processes stable is what turns engineering designs into product at volume. We are seeking a Process Engineer to own the day-to-day operation, uptime, and optimization of the packaging and assembly tools on our production floor.

RESPONSIBILITIES

Own day-to-day operation and uptime of production tools including flip-chip bonders, plasma cleaners, de-flux tools, automated handlers, dispense tools, and wire bonders

Design production processes from the lab bench through proof of concept and production ramp

Monitor and control key process parameters, ensuring repeatability, equipment calibration, and adherence to manufacturing specs

Troubleshoot tool and process issues in real-time, minimizing downtime, and driving fast root-cause resolution

Collaborate with engineering teams to stabilize and improve process flows for die attach, bonding, cleaning, and packaging

Analyze production data and yield trends, identifying opportunities for process optimization and defect reduction

Push process yields above 99.9% and thermal-cycle reliability beyond 1000 cycles

Support factory scaling efforts, qualifying new tools and recipes that enhance unit throughput and yield

QUALIFICATIONS

B.S. or M.S. in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, or a related field

Strong troubleshooting skills with experience maintaining high-uptime operation of precision manufacturing tools

Hands-on experience in semiconductor packaging, assembly, or advanced manufacturing environments

Familiarity with equipment and processes such as flip-chip bonding, wafer processing, plasma cleaning, and wire bonding

Ability to interpret process documentation, equipment specifications, and production data to drive consistent output

Comfortable working in a cleanroom or controlled manufacturing environment with cross-functional engineering teams

Willingness to work extended hours and weekends as needed

PREFERRED EXPERIENCE

Direct experience qualifying or operating production equipment in a high-volume production environment

Knowledge of sub-µm die-bonding, wafer prep, and materials used in advanced packaging

Familiarity with statistical process control and root cause analysis methods

2+ years of experience in process development or yield improvement for optical, photonic, or microelectronic devices

COMPENSATION AND BENEFITS:

Pay range: Process Engineer: $90,000.00 - $140,000.00/per year

Title and base salary are determined on a case by case basis commensurate with experience and merit.

In addition to base salary, compensation for this role includes:

Eligibility for long-term incentives including company stock options and discretionary bonuses awarded for exceptional achievements.

Comprehensive medical, vision, and dental insurance with significant cost covered by the company for yourself and dependents.

Paid parental leave and flexible PTO (3 weeks accrued vacation and 10 company holidays per year).

401(k) retirement plan access.

Relocation assistance to sunny Los Angeles.