Principal Systems Packaging & Assembly Engineer

Key Responsibilities

Package Design & System Integration

• Define and codesign package substrates for MEMS-based silicon photonics optical switching systems.

• Lead package and assembly integration of complex multi-component systems which include MEMs devices, photonic ICs, ASICs, substrates, and optical interfaces.

• Drive mechanical, electrical, and optical integration strategies to ensure system performance, reliability, and manufacturability.

• Collaborate with photonics, MEMS, electrical, and mechanical teams to define packaging requirements and system interfaces.

Assembly Process Development

• Optimize assembly processes including die attach, flip-chip, wire bonding, fiber attach/alignment, and hybrid integration.

• Develop and implement fixtures, jigs, and tooling at our OSATs to support prototype builds and NPI.

• Establish process flows, BOM structures, and manufacturing documentation for new products.

• Identify opportunities for yield improvement, cost reduction, and cycle-time optimization.

NPI & Manufacturing Ramp

• Lead New Product Introduction (NPI) activities from prototype builds through production ramp.

• Work closely with OSAT partners, contract manufacturers, and suppliers to meet our product requirements.

• Drive process qualification, yield ramp, and reliability validation.

• Implement root cause analysis (RCA), corrective actions, and failure analysis workflows.

Supplier & Manufacturing Partner Management

• Direct involvement with OSATs, substrate vendors, optics suppliers, and strategic partners.

• Lead technology transfer from engineering to manufacturing partners.

Program Management

• Act as a technical program manager for packaging and assembly development across multiple engineering teams.

• Coordinate activities between device engineering, system engineering, manufacturing, reliability, and supply chain.

• Track program milestones and ensure packaging readiness aligns with product development timelines.

Required Qualifications

• Bachelor's or Master's degree in Mechanical Engineering, Electrical Engineering, Materials Science, or related field.

• 15+ years of experience in semiconductor or photonics packaging engineering.

• Extensive experience in IC package design and back-end assembly process development in a manufacturing environment.

• Strong background in advanced packaging technologies, such as:

• Flip-chip and wirebond hybrid assemblies

• BGA / FCBGA / CSP / WLCSP

• Multi-die stacking (2.5D / 3D integration)

• System-in-Package (SiP)

• Proven experience driving NPI programs from concept to high-volume production.

• Hands-on experience working with OSATs and contract manufacturers.

• Strong knowledge of yield improvement, failure analysis, and process development.

• Demonstrated ability to lead projects and guide engineers as a senior technical contributor.

• Hands-on expertise with die bonders, dispensers, reflow/TCB tools, wirebonders, and interface metrology (CSAM, X-ray, AOI).

• Strong background in materials characterization and statistical process control (DOE, FMEA, SPC)

Preferred Experience

• Experience with fiber attach and photonic IC packaging.

• Background in optical transceivers, co-packaged optics, or photonics modules.

• Experience with optical modules, photonics packaging, and/or MEMS devices.

• Experience with optical alignment and hermetic packaging solutions.

• Six Sigma certified

• Familiarity with substrate layout tools and packaging design environments (Cadence SiP, AutoCAD, SolidWorks, etc.)