Advanced SMT Process Development Engineer

THE ROLE:

You will be AMD's senior technical expert for advanced SMT and board-assembly process development on high-complexity computing platforms. You will define assembly strategies, influence product design, and make complex PCB assemblies manufacturable, especially those with large BGA packages and significant warpage and coplanarity challenges. Your work will set the standards that manufacturing partners use worldwide.

THE PERSON:

You are a hands-on technical authority who solves non-standard assembly problems using data and engineering judgment. You influence decisions across package, PCB, thermal/mechanical, reliability and manufacturing teams without direct people management, and you communicate complex topics clearly to different audiences.

KEY RESPONSIBILITIES:

• Lead end-to-end SMT process development (stencil/printing, placement, reflow, post-reflow) and define robust process windows for yield, reliability and scale.
• Own assembly of large, high-warpage BGA packages. Turn warpage, coplanarity and thermal data into design rules, process controls and board-support/fixture concepts.
• Reduce solder defects (insufficient solder, head-in-pillow, bridging, voiding) through stencil design, paste/flux selection and reflow optimization, including vacuum and inert-atmosphere reflow.
• Define and qualify edge bonding and underfill strategies to improve mechanical shock, vibration and board-level reliability. Develop manufacturable processes for integrating mechanical and thermal hardware (heatsinks, clamping, thermal interface materials).
• Evaluate how mechanical stress transfers to solder joints. Make sure post-SMT and controlled BGA rework processes are repeatable, auditable and meet reliability requirements.
• Lead DFM reviews (land patterns, via-in-pad, solder mask, keep-outs), and author board-assembly guidelines and BKMs for internal teams and EMS partners.
• Run DOEs and root-cause analysis for complex yield and reliability issues. Evaluate new technologies such as low-temperature solder, micro spring/spacer and removable-lid concepts.
• Work with contract manufacturers, material suppliers and equipment vendors to qualify capability and drive improvements.

PREFERRED EXPERIENCE:

• Extensive hands-on SMT process development for high-complexity PCB assemblies, from engineering builds to high-volume manufacturing.
• Proven experience with large BGAs (>70 mm) and high warpage (~400–500 µm), including warpage measurement (Shadow Moiré, DIC) and inspection (X-ray, C-SAM).
• Strong DOE, statistical and root-cause analysis skills (Minitab, JMP or equivalent).
• Knowledge of IPC/J-STD standards and board-level reliability qualification (temperature cycling, vibration, mechanical shock, failure analysis).
• Experience working with global EMS partners and equipment vendors.
• Familiarity with PCB CAD tools (Mentor Graphics, Cadence Allegro or Pentalogix) for DFM review.

ACADEMIC CREDENTIALS:

Bachelor's or Master's degree in Manufacturing Engineering, Mechanical Engineering, Materials Science or a related discipline.

LOCATION:

Singapore