Equipment Engineering Trainee (Chemical Mechanical Planarization - CMP) - GRIT Traineeship

The trainee will undergo a structured 6-month on-the-job training programme within the CMP Equipment Engineering team in a 300mm semiconductor wafer fabrication facility. The programme aims to develop practical knowledge and hands-on competencies in semiconductor equipment maintenance, equipment troubleshooting, preventive maintenance, spare parts management, and equipment performance monitoring. Under the guidance of experienced engineers, the trainee will support day-to-day equipment operations while developing the technical foundation required for an Equipment Associate Engineer role.

1. Learn semiconductor manufacturing fundamentals and the role of CMP equipment in wafer fabrication.
2. Support equipment monitoring activities to ensure stable tool performance and availability.
3. Assist engineers and senior technicians in preventive maintenance activities for CMP equipment.
4. Participate in alarm response, basic troubleshooting, and failure analysis under supervision.
5. Learn equipment documentation, maintenance reporting, and cleanroom operating procedures.
6. Support spare parts inventory tracking and equipment maintenance planning activities.
7. Participate in equipment reliability and continuous improvement initiatives.
8. Complete a structured equipment improvement project and present findings at the end of the traineeship.

Requirement

• Semiconductor manufacturing fundamentals.
• Understanding of CMP process and equipment operations.
• Preventive and corrective maintenance practices.
• Equipment troubleshooting and root cause analysis.
• Equipment performance monitoring and basic reliability concepts.
• Spare parts and inventory management.
• Technical documentation and maintenance reporting.
• Problem-solving and analytical skills.
• Workplace safety and cleanroom compliance.
• Communication and teamwork in a manufacturing environment.