Silicon Photonics Engineer

Your tasks

• Develop, integrate, and optimize 300mm Silicon Photonics (SiPh) technology platforms for pluggable optical modules, co-packaged optics (CPO), and photonic interposer applications.
• Collaborate with R&D, process integration, and module engineering teams to define, develop, and execute SiPh process flows.
• Translate customer requirements into device specifications, process requirements, and technical solutions through discussions and in-depth technical reviews.
• Coordinate with external OSATs (Outsourced Semiconductor Assembly and Test providers) and technology partners for Photonic Integrated Circuit (PIC) and Electronic Integrated Circuit (EIC) characterization and packaging integration.
• Support optical device design, process integration, characterization, and performance optimization.
• Apply Design of Experiments (DOE), Failure Mode and Effects Analysis (FMEA), and control plan methodologies to improve process robustness, product quality, and manufacturing readiness.
• Perform data-driven analysis, identify process deviations, investigate root causes, and implement corrective and preventive actions.
• Assess technical risks and drive continuous improvement throughout technology development, validation, and qualification.
• Work closely with cross-functional teams and external stakeholders to ensure successful technology development and integration.

Requirements

Required Qualifications and Skills

• Bachelor’s degree in Electronics, Electrical Engineering, Physics, Materials Engineering, or a related technical field.
• Minimum 3 years of hands-on experience in Silicon Photonics (SiPh) R&D, process development, process integration, or a closely related field.
• Strong technical background in one or more of the following:
• Silicon Photonics process development and integration.
• Photonic Integrated Circuit (PIC) design, fabrication, or characterization.
• Optical device design and performance characterization.
• Photonic packaging and integration.
• Semiconductor foundry process development and module-level engineering.
• Familiarity with semiconductor foundry environments and technology development workflows.
• Working knowledge of DOE, FMEA, control plans, and structured problem-solving methodologies.
• Strong analytical, troubleshooting, and data interpretation skills.
• Excellent communication and collaboration skills, with the ability to engage internal engineering teams, customers, OSATs, and external partners.
• Self-motivated, curious, and committed to innovation, quality, and continuous improvement.

Preferred Qualifications

• Experience with 300mm semiconductor wafer processing and technology development.
• Exposure to silicon photonics applications in high-speed optical communications, data centers, or advanced packaging.
• Knowledge of co-packaged optics (CPO), pluggable optical transceivers, photonic interposers, and PIC/EIC integration.
• Experience supporting process qualification, technology transfer, yield improvement, or manufacturing ramp-up.