Senior Process Integration Engineer (Technology/Development/Manufacturing)

Key Responsibilities Development and optimization of RFSOI process technologies for 2DIC and 3DIC.

Collaborate with device teams to co-optimize RF device performance and layout for high-volume manufacturing.

Drive yield improvement, reliability testing, and failure analysis for RFSOI products.

Interface with fab teams to scale new technologies from R&D to production.

Evaluate emerging materials, process modules, and device structures to enhance RF performance.

Qualifications Masters or Ph.D. in Electrical Engineering, Materials Science, Semiconductor Physics, or related field.

3+ years of experience in RF semiconductor technology development, with a strong focus on SOI platforms preferred.

Proven track record in developing and transferring RF technologies to high-volume manufacturing preferred.

Strong project management and communication skills.

Interested applicants, please click  “Apply Now”  or email your detailed resume (MS Word or PDF) to:  ••••@tempserv.com.sg Tempserv Pte Ltd EA License No: 06C3745 Consultant: Chuah Siew Ping/EA Personnel No: R24123260