5 days Application Engineer up to $6000 (Woodlands)

Application Engineer $4,000 – $6,000 9am – 6pm (Mon to Fri) Woodlands Job Responsibilities Develop, optimize and qualify die bonding processes and equipment. Set up, calibrate and troubleshoot machines; adjust process parameters and recipes. Conduct root cause analysis and implement corrective actions for equipment/process issues. Support process improvement, yield enhancement and cycle-time optimization. Collaborate with R&D, Engineering, Manufacturing and Quality teams on technical issues. Provide installation, application and technical support at customer sites. Conduct customer training and support Field Application Engineers. Gather customer feedback and support product/process improvement. Requirements Diploma or Degree in Mechanical, Mechatronics, Electrical/Electronics, Materials, Manufacturing, Automation or related Engineering disciplines. Minimum 2 years of relevant experience in semiconductor equipment, automation, advanced packaging or precision manufacturing. Experience in die bonding/die attach, flip-chip, wire bonding, SMT, wafer handling, semiconductor automation or precision robotics. Hands-on experience in machine setup, calibration, troubleshooting and parameter adjustment. Knowledge of precision motion systems, servo systems, sensors, vacuum, pneumatics and tooling. Experience with vision/alignment or precision positioning systems is an advantage. Familiar with process engineering and data analysis, including DOE, SPC, Cp/Cpk, GR&R or process qualification. Knowledge of RCA and problem-solving tools such as 5-Why, Fishbone, 8D, DOE or FMEA. Willing to travel to customer sites when required.

Company Name: Talent Recruitment Pte Ltd EA License No: 24C2338 EA Personnel Name: Loke Sai Lye (Loke) EA Personnel No: R24123366 Email: sales@talentrecruitmentsg.com Contact Number: 81688648