Senior / Associate Process Engineer - Wafer Backgrind, Laser Mark, Wafer Saw
Senior
About the company
STATS ChipPAC is a leading provider of semiconductor packaging and test services. We are committed to delivering innovative engineering solutions and maintaining excellence in manufacturing processes. Our team of skilled engineers and technicians work collaboratively to push the boundaries of what's possible in semiconductor technology, serving clients across diverse industries and markets worldwide.
Your tasks
About the role Provide process engineering support on the following Backend2 process: (1) Wafer Backgrind (2) Laser Mark (3) Wafer Saw and process operational issues as per guidance of Process Engineer.
- Perform production line sustaining to ensure all the processes are running without any quality issue
- Follow up the process improvement projects which assigned by Process Engineer
- Characterize new devices and create recipes in the machine.
- Immediate response to investigate and analyze products with problem
- Cross support with line supervisor to clear real time bottleneck that impact cycle time and quality
- Cross support with other Associate Engineer to clear equipment downtime
- Communicate with Engineers and external vendors to resolve problems and provide advanced training to less experienced Technical Specialists or Manufacturing Specialists
Requirements
- Diploma or Degree in Electric & Electronic, Mechanical & Mechatronics, Physics Engineering or equivalent
- 2 years of relevant experience in EWLB or WLCSP are preferred
- Positive mindset with ability to adapt to fast-paced working environment
- Ability to work on 12 hours rotating shift