R&D Singulation/Dicing Process Engineer

About the role Develop, optimize, and stabilize wafer/package separation processes, including Laser Grooving, Stealth Dicing, Blade Dicing, and Molded Wafer Singulation, for advanced semiconductor packaging. Drive process readiness, yield improvement, robustness, and customer-specific technical solutions toward production. Key responsibilities Develop and qualify separation processes for 2.5D, Fan-In, Fan-Out, and eBar technologies

Lead DOE, process optimization, characterization, and continuous improvement using statistical tools such as JMP

Perform hands-on process setup and optimization of Laser Groove, Stealth Dicing, and Blade Dicing equipment

Drive process validation, yield stabilization, troubleshooting, and root-cause analysis

Develop/review FMEA, OCAP, and Control Plans to mitigate process risks and support LVM readiness

Provide technical support for customer programs, including feasibility evaluation and issue resolution

Collaborate with cross-functional teams including R&D, Process Engineering, Equipment, Quality, and Operations to drive process qualification, technology transfer, and manufacturing readiness

About you Bachelor's degree in Engineering (Mechanical/Materials/Electronics)

3-5 years of hands-on experience in process engineering in semiconductor manufacturing

Fundamental understanding of advanced semiconductor fabrication and integration processes

Proficiency in preparing technical documentation and delivering presentations

Experience in Si Photonics applications, backgrinding, CMP, and planarization is an added advantage