AI Deployment Engineer

Location: Chai Chee/Bedok

Department: Die Processing Service (DPS)

Responsibilities:

• Co-work with external solution provider on end-to-end deployment of AI solutions (computer vision inspection, workflow automation, analytics) for Visual Inspection Process of wafer level chip scale package at Backend process
• Translate users’ requirements (eg. auto defect classification, recipe re-teach etc…) into system configurations and AI workflows
• Ensure deployed solutions are robust, scalable, and aligned with real production constraints including uptime, safety, and compliance requirements.
• Contribute to standardized deployment frameworks and best-practice documentation that accelerate future engagements.

Requirements:

• Bachelor's Degree in Computer Science, Computer Science, Electrical Engineering, Mechatronics, or a related technical discipline.
• Proficient in programming languages such as Python, Arduino C++, or similar; comfort with scripting, configuration, and debugging in production settings.
• Familiarity with equipment communication protocols (e.g., SECS/GEM, OPC-UA) or manufacturing execution systems (MES).
• Experience with system integration, data pipelines, edge computing, or cloud deployment in operational technology(OT) environments.
• Exposure to AI/ML concepts, deep learning frameworks, or computer vision tooling (e.g., OpenCV, PyTorch, TensorFlow)