Sr Staff Engineer
Generate project timelines/ plans for Assembly Engineering projects. Schedules and timelines are aligned to PMO master project timeline.
Efficient project management execution within given timescales: Liaise within the Assembly Engineering team (Package Design, Package Simulation, Documentation,activities to ensure all assembly packaging deliverables are aligned to the project timeline. Completion of Process Characterization/Tooling buy-off and processing of Engineering Samples to ensure 1st Engineering Samples are provided on time with quality. Manage the BLRT activities as per JEDEC/Customer/Project requirements. Pragmatism and flexibility during project execution to accommodate delays/changes that may occur. Close and open communication within the Assembly Project Team & Assembly Subcons to ensure correct information exchange and synergy.
Attends the Project core team meetings to represent the Assembly packaging team. Provides accurate project updates and coordinate any deliverables for the assembly packaging team and ensures accurate responses are provided. Drive and attend related OSAT/Subcon meetings for project reviews. Drive CIP (Continuous improvement programs) and work with OSAT to find for a solution for any technical issues that may arise during NPI stage. Responsible for the smooth NPI Project Hand over to off-shore Assembly team sustaining. Ensures completion of all NPI deliverables, completed and passed qualification and results are all within expectations (BOM & BOR, Yield, Cpk). Detailed and accurate weekly reporting to Line Manager for related projects.
Degree in Electronic and/or Mechanical Engineering or an equivalent qualification with sufficient years of experience. Project Management experience using MS Project (3 years or more) Knowledge and experience of Package assembly process for WLCSP, Fan-out WLCSP, Flipchip, BGA, QFN, other substrate and leaded packages (3 years or more) Ability to use different problem solving techniques (e.g. RCCA, 8D and other problem-solving methodology) that can help during troubleshooting of technical issues with OSAT. Flexible to undertake occasional international travel at short notice Excellent command of verbal and written English
Nice to Have: Ability to work independently with minimal supervision, as well as collaboratively within a team Strong communication and presentation skills in a multi-site, multicultural environment
Ability to share technical expertise and knowledge effectively Results-oriented mindset with the ability to meet deadlines under tight schedules Creative problem-solving skills and the ability to propose innovative solutions Cross-cultural awareness and sensitivity Proven ability to contribute to projects and business initiatives
Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier . With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future. At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives. We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process. Are you ready to join our team and shape the future with us? Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement .