Staff Process Integration Engineer (Semicon, All Devices) x 5

Key Responsibilities: Process Integration & Device Physics: Defining and maintaining FEOL/BEOL integration process flows across specialty platforms (BCD, SiPh, High-Voltage, CMOS, MEMS).

NPI & Technology Transfer: Leading technology qualification, baseline process freeze, tool evaluations, and technology transfers between R&D fabs and volume production sites.

Yield & Parametric Optimization: Driving yield learning, inline defect reduction, electrical test (ET/PCM) analysis, and Design of Experiments (DOE).

Cross-Module Problem Solving: Partnering with Photo, Etch, Thin Films, CMP, and QA teams on failure analysis (FA) and root-cause resolution (8D, PFMEA).

Qualifications: Education: Degree / Master's / Ph.D. in Microelectronics, Electrical Engineering, Physics, or Materials Science.

Experience: 8+ years (Staff) or 12+ years (Principal) in wafer fab process integration, yield learning, and device engineering.