Solder Paste Printing Equipment Engineer

1. Equipment Management and Maintenance

• Responsible for the daily maintenance, upkeep, and calibration of SMT production line printing machines, chip mounters, and reflow ovens to ensure equipment is in good operating condition.
• Formulate and execute equipment Preventive Maintenance (PM) plans to reduce equipment failure rates.
• Responsible for rapid analysis and repair of equipment abnormalities to ensure uninterrupted production.
• Record and analyze equipment downtime, failure types, and causes, driving improvements to enhance Overall Equipment Effectiveness (OEE).

1. Process and Quality Assurance

• Assist Quality and Process Engineering teams in analyzing printing and mounting results and providing process improvement suggestions.
• Perform SMT program programming, debugging, and verification for New Product Introduction (NPI) to ensure production yield meets standards.

1. New Equipment Introduction and Technical Advancement

• Participate in the evaluation, selection, installation, and acceptance (IQ/OQ/PQ) of new models or new technologies for printing machines, chip mounters, and reflow ovens.
• Responsible for new equipment parameter setting and optimization to ensure equipment capability meets Cmk/Cpk requirements.
• Drive the introduction and evaluation of SMT equipment automation and AI.

Qualifications: Educational Background: Bachelor's degree or above, in Electronic Engineering, Automation, Mechatronics, Computer Science, or related majors. Possess 2+ years of experience in SMT process or equipment maintenance. Familiar with Fuji printing machine GPX, chip mounter NXT/AIMEX/NXTR, and reflow oven Ersa/Rehm. Preference will be given to those familiar with Fuji chip mounter program creation and online adjustment experience. English TOEIC score of 450 or above, with ability in listening, speaking, reading, and writing.