Senior Advanced Packaging Application Engineer
(Thermo Compression Bonding – TCB) Responsibilities: Customer Application Engineering Understand customer packaging roadmaps and manufacturing requirements.
Translate process requirements into equipment specifications.
Participate in customer technical discussions and application reviews.
Support technical sales activities and customer demonstrations.
Gather customer feedback and recommend future product enhancements.
Advanced Packaging Process Development Develop and support applications involving:
Thermo Compression Bonding (TCB)
Flip Chip Assembly
Hybrid Bonding
HBM Packaging
CoWoS
CoPoS
2.5D Packaging
3D Packaging
Chiplet Integration
Large Die Packaging
Evaluate and optimize:
Bond force
Temperature profiles
Process windows
Alignment accuracy
Package warpage
Yield
Reliability
Equipment Development Work closely with multidisciplinary engineering teams to define:
Machine architecture
Functional specifications
Accuracy requirements
Throughput targets
Thermal performance
Bonding process capability
Reliability requirements
Customer acceptance criteria
- Provide technical guidance throughout equipment development.
Machine Qualification Serve as the internal customer during equipment development.
Responsibilities include:
Defining machine acceptance criteria
Process qualification
FAT and SAT support
Customer buyoff support
Qualification reporting
Continuous performance improvement
Technology & Market Intelligence Monitor industry developments in:
Advanced packaging technologies
Semiconductor manufacturing trends
Customer requirements
Competitor equipment
Emerging packaging architectures
Support future product strategy and technology roadmap planning.
Requirements: Bachelor's or Master's Degree in:
Materials Engineering
Mechanical Engineering
Electrical Engineering
Chemical Engineering
Physics
Semiconductor Engineering
Related Engineering disciplines
Minimum 5 years experience in semiconductor advanced packaging.
Hands-on experience in one or more of the following:
Thermo Compression Bonding (TCB)
Advanced Packaging Process Development
Flip Chip Assembly
New Product Introduction (NPI)
Process Qualification
Equipment Qualification
Manufacturing Engineering
Customer Process Development
Experience supporting advanced package technologies such as:
HBM
CoWoS
CoPoS
Chiplets
2.5D Packaging
3D Packaging
Large Die Packaging
Experience with TCB equipment from ASMPT, BESI, Toray, Panasonic, Kulicke & Soffa or similar suppliers will be an advantage.
Candidates currently or previously employed by semiconductor manufacturers or advanced packaging companies are strongly encouraged to apply.
Strong understanding of:
Thermo Compression Bonding (TCB)
Semiconductor Packaging
Flip Chip Assembly
Process Qualification
SPC
DOE
Yield Improvement
Reliability Testing
Failure Analysis
Package Warpage
Thermal Management
Alignment Accuracy
Semiconductor Manufacturing Processes
Knowledge of AI accelerator packaging, HBM integration or heterogeneous integration will be highly regarded.