Semicon Wirebond Development Senior /Engineer

People ProfilersSingaporemycareersfuturepublished 09/03/2026
Must-have:BackendLead

The role focuses on developing, qualifying, and sustaining wire bonding processes forsemiconductor assembly, from NPI through mass production.

Key responsibilities:

  • Develop and optimize KNS wire bonding processes, including recipes, bonding parameters, loop profiles, and bond locations.
  • Lead NPI, process characterization, DOE, process qualification, and production ramp-up activities.
  • Provide hands-on production troubleshooting and sustaining support for wire bonding process and equipment issues.
  • Work with Equipment Engineering on machine setup, preventive maintenance, qualification, installation, relocation, and machine-to-machine matching.
  • Investigate wire bonding failures using 5-Why, Fishbone, DOE, statistical analysis, and failure-analysis techniques.
  • Improve yield, UPH, process capability, equipment utilization, quality, and manufacturing efficiency.
  • Support SPC, OOC/OOS investigations, FMEA, bond pull/shear testing, customer audits, and quality requirements.
  • Evaluate and support different wires, capillaries, leadframes, substrates, and bonding technologies, including Au, Cu, Ag, and Pd-coated wires.
  • Prepare process specifications, control plans, work instructions, qualification reports, and technical presentations.
  • Collaborate closely with Production, Equipment, Quality, Product Engineering, Materials, NPI teams, and external suppliers.

Requirement:

  • Bachelor’s degree in Mechanical, Electrical, Electronics, Manufacturing, Materials Engineering, or a related discipline .
  • Experience in semiconductor assembly, wire bonding, or backend manufacturing is preferred.
  • Hands-on experience with wire KNS bonding equipment
  • Good understanding of wire bonding processes, equipment, materials, capillaries, leadframes
  • Experience in NPI, process qualification, DOE, SPC, FMEA, and root cause analysis .
  • Strong troubleshooting and analytical skills with a hands-on approach to production problems.
  • Good understanding of semiconductor assembly manufacturing processes and quality requirements.
  • Strong communication and interpersonal skills with the ability to work effectively in a cross-functional environment.
  • Able to work independently, manage multiple projects, and meet NPI and production support timelines.

Pleaseemail your resume in a detailed MS Word format to joyce@peopleprofilers.com stating

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  2. Expecting Salary
  3. Date Available
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Weregret that only shortlisted candidates will be notified

JoyceKoh Ai Leng PeopleProfilers Pte Ltd 20Cecil St, #08-09, PLUS Building, Singapore 049705 Tel:6950 9737 www.peopleprofilers.com EALicense Number: 02C4944 EAPersonnel Reg nos : R1110618 JobID: JOB-01108

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