R&D Process Engineer (Die-to-Wafer)

About the company

People Profilers Pte Ltd

• 20 Cecil Street, #08-09, Plus Building, Singapore 049705
• Tel: 69509745
• EA Licence Number: 02C4944
• EA Registration Number: R1108448
• EA Personnel: Tan Lili Gesse

Your tasks

• Develop, optimize, and stabilize wafer/package separation processes, including Laser Grooving, Stealth Dicing, Blade Dicing, and Molded Wafer Singulation, for advanced semiconductor packaging.
• Drive process readiness, yield improvement, robustness, and customer-specific technical solutions toward production.

*Key Job Accountabilities (Actual daily deliverables)**

• Develop and qualify separation processes for 2.5D, Fan-In, Fan-Out, and eBar technologies.
• Lead DOE, process optimization, characterization, and continuous improvement using statistical tools such as JMP.
• Perform hands-on process setup and optimization of Laser Groove, Stealth Dicing, and Blade Dicing equipment.
• Drive process validation, yield stabilization, troubleshooting, and root-cause analysis.
• Develop/review FMEA, OCAP, and Control Plans to mitigate process risks and support LVM readiness.
• Provide technical support for customer programs, including feasibility evaluation and issue resolution.
• Collaborate with cross-functional teams including R&D, Process Engineering, Equipment, Quality, and Operations to drive process qualification, technology transfer, and manufacturing readiness.
• Support advanced packaging separation process development andqualification.
• Improve yield, quality, process capability, and manufacturing robustness.
• Drive process innovation aligned with customer programs and technologyroadmaps.
• Support customer technical requirements and timely resolution of processissues.
• Conduct process characterization, data analysis, and technical risk assessment to establish robust and scalable processes.
• Experience in Si Photonics applications, backgrinding, CMP, and planarization is an added advantage.

Requirements

• Bachelor’s degree in Engineering(Mechanical/Materials/Electronics)
• 3-5years of hands-on experience in process engineering in semiconductor manufacturing.
• Fundamental understanding of advanced semiconductor fabrication and integration processes.
• Proficiency in preparing technical documentation and delivering presentations

What we offer

All Successful candidates can expect avery competitive remuneration package and a comprehensive range of benefits.

How to apply

Kindly email your resume in adetailed Word format to gesse.tan@peopleprofilers.com

1. Current and Expected Salary

2. Date of availability

3. Reason for leaving each job:

Other

JOB ID: JOB-JK30102026