Associate Engineer – Wire Bond Equipment

Your tasks

We are seeking a motivated and hands-on Associate Engineer to support the setup, maintenance, troubleshooting, and repair of wire bond equipment in a semiconductor manufacturing environment.

Key Responsibilities  Perform machine setup, qualification, and conversion for wire bond equipment. 

Troubleshoot and repair equipment-related issues to minimize production downtime. 

Conduct preventive and corrective maintenance activities. 

Monitor equipment performance and implement improvement actions. 

Support production during machine breakdowns and urgent technical issues. 

Perform root cause analysis and corrective actions. 

Maintain equipment documentation and spare parts records.

Requirements

Job Requirements  Minimum Diploma in Electrical, Electronics, Mechanical, Mechatronics Engineering or related field. 

Minimum 2 years of hands-on experience in wire bond equipment maintenance and troubleshooting. 

Experience with KNS Maxum, iConn, or Rapid Bonder machines is preferred. 

Strong troubleshooting and problem-solving skills. 

Knowledge of semiconductor backend assembly processes is an advantage. Working Conditions 

What we offer

All Successful candidates can expect avery competitive remuneration package and a comprehensive range of benefits.

How to apply

Kindly email your resume in adetailed Word format to gesse.tan@peopleprofilers.com

1. Current and Expected Salary

2. Date of availability

3. Reason for leaving each job:

EA Personnel: Tan Lili Gesse

Other

Able to support 12-hour rotating shifts. 

Willing to work both Day Shift and Night Shift based on operational requirements.

JOB ID: JOB-JK00882

People Profilers Pte Ltd 20 Cecil Street, #08-09, Plus Building, Singapore 049705 Tel: 69509745