Staff Engineer ,CVD ADV. NAND PD

About the company

Embody Micron’s Core Values

• People – Diversity of thought to propel technology leadership - Ideas can come from anywhere
• Innovation– Challenge and disrupt the status quo – fail fast and learn faster, optimize with Artificial Intelligence solutions
• Tenacity– Own the problem to closure through a first principles approach
• Collaboration – Partner with Product and Manufacturing to deliver end-to-end technology solutions
• Customer Focus – Powering Micron’s Storage products through industry-leading technology
• Speed – Moving fast on what matters, without compromising quality

Your tasks

• Develop, optimize, and characterize thin film processes (CVD) to meet performance, reliability, and manufacturability targets.
• Design and execute experiments, analyze data, and communicate results in appropriate technical forums.
• Perform film characterization using appropriate techniques (examples referenced: SEM, TEM, XPS, SIMS, AFM) and correlate results to process outcomes.
• Support process transfer and pilot line execution, including sustaining process maturity/capability for processes under ownership.
• Collaborate with multi-functional partners (Process Integration, Metrology, Surface/Characterization labs, Electrical Failure Analysis, Yield, Manufacturing, and equipment vendors/suppliers) to ensure robust processes that meet physical/electrical requirements.

Other Responsibilities

• Maintain accurate documentation of experiments, process settings, and learnings; produce technical reports and summaries.
• Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.
• Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work.

AI Responsibilities

• Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.
• Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work.

Requirements

Minimum Required Qualifications / Experience

• PhD, or Master’s ≥3 yrs, or Bachelor’s ≥5 yrs of relevant experience in

Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related field

• Demonstrated foundation in thin film deposition and characterization; R&D/PD environment readiness is important for this role.

Must-Have Technical Skills

• Fundamentals of thin film deposition (CVD) and film characterization.
• DOE/SPC basics; ability to analyze experimental data and draw conclusions.
• Understanding of plasma/vacuum systems and process-chemistry relationships (where applicable).

Must-Have Soft Skills

• Structured problem-solving and learning agility in an R&D environment.
• Clear communication and cross-functional collaboration.

Highly Desirable / Preferred

• Exposure to dielectric / carbon-based films and NAND structural/electrical requirements.
• Experience working with equipment suppliers or tool qualification/transfer activities.

AI Requirements

• Ability to apply baseline digital fluency and role appropriate AI literacy to use AI enabled tools responsibly and effectively for research, analysis, content creation, problem solving, operational tasks, and achieving business outcomes.