Principal Engineer , CMP Advanced NAND

About the company

As a Staff/Principal Engineer, you will be a part of groundbreaking next generation NAND research & development dry etch team driving critical modules listed below. The position promises ample opportunities for innovation, collaboration and testing a new dimension and scaling with next generation NAND. You will work directly with process integration and other process areas such as Wet etch, CVD, Diffusion, Metals, Lithography & Dry Etch. You will be involved with innovative and outstanding dry etch chambers & own the process roadmap to meet program and yield goals. Your responsibilities include, but not limited to:

Embody Micron’s Core Values People– Diversity of thought to propel technology leadership - Ideas can come from anywhere

Innovation – Challenge and disrupt the status quo – fail fast and learn faster, optimize with Artificial Intelligence solutions

Tenacity – Own the problem to closure through a first principles approach

Collaboration – Partner with Product and Manufacturing to deliver end-to-end technology solutions

Customer Focus – Powering Micron’s Storage products through industry-leading technology

Speed – Moving fast on what matters, without compromising quality

Your tasks

• As a CMP Process Development Engineer, you will develop and optimize chemical mechanical planarization procedures. These procedures aim to improve product quality and reliability for the next generation of Micron's memory parts.
• Focus on understanding and improving the process margins required for meeting the mature yield goal for 3D NAND parts
• Advanced 3D NAND CMP process development will include performing fundamental research, consumables development, and hardware evaluation, as well as testing processes for novel applications
• Initiate and manage experiments to widen process margins as well as to evaluate manufacturability of next node solutions
• Extensively collaborate with vendors to develop processes that meet integration requirements for current and next-generation 3-D NAND nodes
• Incorporate best known manufacturing methods into early development phase of upcoming nodes
• Design and implement advanced process monitoring and control methodologies
• Provide strategic roadmap for N+, N++ and future NAND Nodes
• Serve as a technical expert within Micron contributing to technical projects for improvements to processes, procedures, and equipment
• Define and leads complex, multi-functional projects of critical importance to Micron, helps to define strategic direction
• Provide advice and counsel to management on significant technical issues. Leads and initiate innovation projects through patents/technical papers
• This position requires communication and collaboration with partners both locally and globally. Strict adherence to Micron Intellectual Property Protection policy is necessary

Other Responsibilities

• Mentor new hires and less experienced team members on CMP fundamentals, process development, and Micron systems
• Engage with Procurement & Operations Central Teams and other partners both locally and globally pushing for breakthrough solutions
• As a technical expert, lead or drive team or sites on complex, multi-disciplinary projects in quality focused meetings, process and yield improvement meetings, cost, and productivity improvement meetings

AI Responsibilities

• Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.
• Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work.

Requirements

Education/Job requirements

• Masters /PhD with 5-10 years or Bachelors degree with 7-12 years of relevant working experience in the semiconductor industry with a background in Chemical Mechanical Planarization (CMP) Process in 300mm wafer fabrication

Must Have Technical Skills

• Hands-on experience CMP equipment operation such as AMAT (LKP), EBARA-300X and next generation CMP equipment, optical metrology, profilometry, polishing slurries, conditioners, and polishing pads
• Experience in dielectrics/metals CMP process development on 3D NAND or other memory technology
• Understanding of various integration and structural impacts and constraints related to film deposition and other upstream/downstream processes

Must Have Soft Skills

• Excellent oral and written communication skills with ability to convey the message in concise and effective manner both in local as well as remote communications.
• Strong collaboration and communication skills (verbal and written).
• Self-driven, adaptable, and able to manage multiple projects.
• Proven ability to take calculated risks and execute novel solutions.
• Recognized as a mentor, team player and technical expert with the ability to solicit feedback, accept input, and analyze success/failure.

Highly Desirable/Preferred skills or experience

• An understanding of the general process steps and process flow for memory processing planar and vertical NAND memory.
• Strong interest in Data science, modelling, and drive to use/adopt AI to optimize workflows.

AI Requirements

• Ability to apply baseline digital fluency and role appropriate AI literacy to use AI enabled tools responsibly and effectively for research, analysis, content creation, problem solving, operational tasks, and achieving business outcomes.