Principal Engineer – 3D NAND Process Integration

About the Role Join Micron’s Advanced NAND Technology (ANT) Singapore team to drive the future NAND technology roadmap through advanced pathfinding and integration. In this role, you will work in a cutting-edge R&D environment, developing next-generation memory technologies by bridging device concepts, materials, and process integration into manufacturable solutions. You will leverage AI-enabled data analytics and model-driven methodologies to analyze complex datasets, accelerate learning cycles, and solve critical scaling challenges, directly impacting future memory nodes. Key Responsibilities Drive 3D NAND integration and technology roadmap , leading pathfinding and advanced architecture enablement.

Lead end-to-end development (conception → technology validation) including learning vehicles, characterization, and debug.

Solve complex integration challenges using data-driven, AI-assisted, and model-based approaches , identifying critical technology gaps and enabling solutions.

Define and optimize module/process architecture (electrical targets, process flows, design rules) to meet product requirements.

Collaborate across the full ecosystem (Device, Probe, Test, Design, Operations) to drive performance, yield learning, and execution.

Drive technical innovation through process improvements, patents, and publications while building strong global networks.

Qualifications Strong foundation in semiconductor device physics and process integration

Experience in memory (NAND/DRAM), CMOS/logic, or emerging/embedded memory technologies

Proven ability in experiment design, data analysis, and problem-solving

Ability to work across cross-functional R&D teams

Strong communication and collaboration skills

Demonstrated innovation mindset , with exposure to advanced data analytics or AI/ML techniques a plus

Education MS or PhD in Electrical Engineering, Materials Science, Physics, Chemical Engineering, or a related field About Micron Technology, Inc. Micron Technology is a global leader in memory and storage solutions, delivering innovation in DRAM and NAND technologies that power AI, data centers, and next-generation computing.