Product Specialist - Flip Chip/Wire Bond

Process-Oriented Product Specialist who understands semiconductor packaging and bonding processes Key skills:

• Thermal Compression Bonding (TCB)
• Die Attach / Die Bonding
• Wire Bonding
• Flip Chip
• Advanced Packaging (SiP, WLCSP, BGA, QFN)
• Semiconductor Process Engineering

The role involves providing technical support to customers, troubleshooting process-related issues, collaborating with engineering teams, and supporting semiconductor assembly and packaging solutions across region.