PCB Design Engineer

Component placement and routing of high-complexity multilayer PCBs (FPGA/SoC, DDR, JESD204, PCIe, Ethernet, LVDS, GT); Routing of RF paths (AD9361, ADRV9008, LO distribution, differential RF lines, controlled impedance); Development of layer stackup, participation in material selection, and coordination of parameters with manufacturing; Control of Signal Integrity / Power Integrity requirements: impedance, trace lengths, differential pairs, return currents, decoupling placement; Preparation of component placement requirements in collaboration with circuit designers and participation in PCB architecture; Use of high-density interconnect technologies: blind/buried via, microvia, via-in-pad, backdrill where necessary; Preparation of a production documentation package: Gerber, drill files, stackup, fabrication notes, assembly files; Interaction with PCB manufacturers and contract manufacturers, coordination of technological constraints; Conducting DFM/DFT analysis, checking manufacturability, and participating in preparing boards for production; Participation in analyzing routing issues and making changes based on debugging results; Optional: participation in architecture development (Technical Specifications, E1, E2), development of electrical schematics (E3), as well as immersion in any adjacent areas of embedded systems development: system architecture, FPGA or MCU programming, etc.

Requirements

• Higher technical education in radio engineering or related fields;
• At least 3 years of experience in multilayer PCB routing, including high-speed digital interfaces (DDR, PCIe, Ethernet, JESD, LVDS);
• Experience in routing RF paths and FPGA-based boards will be an advantage;
• Experience working in PCB CAD software (Altium, Allegro, KiCad, or similar);
• Ability to identify and resolve issues after review and hardware verification;
• Experience interacting with manufacturing and suppliers to coordinate technological constraints;
• Experience in supporting and updating internal standards, component libraries, and routing rules;
• Systematic engineering mindset, ability to see the interaction of board components and the path as a whole;
• Attention to detail and accuracy when preparing documentation and production files;
• Ability to work independently and make routing decisions considering technological constraints;
• Inclination towards analytical and research work, understanding signal physics and parasitic effects;
• Responsibility for design quality and meeting board release deadlines;
• Ability to interact effectively with circuit designers, RF engineers, and manufacturing;
• Readiness to master new CAD tools and PCB design technologies, including high-speed and RF routing.

Required knowledge and skills:

• Knowledge of multilayer PCB routing principles, component placement, stackup development;
• Signal Integrity / Power Integrity: impedance control, differential pairs, return currents, decoupling;
• Knowledge of high-speed interface routing requirements: DDR, PCIe, Ethernet, JESD204, LVDS, SerDes;
• Knowledge of RF routing basics: matching, controlled impedance, path isolation, minimization of parasitic effects;
• Skill in working with vias and layers: via strategies, return currents, backdrill, layer transitions;
• Skills in preparing production documentation, accounting for technological constraints, and interacting with manufacturing;
• English language at the level of reading technical documentation;
• Skill in preparing and releasing production files (Gerber, ODB++, drill files, assembly instructions);
• Skill in supporting existing projects, making changes, and preparing board revisions.

Higher education — Bachelor's degree; Experience: 3 years