Equipment Senior / Engineer (semiconductor industry)

Equipment - CoW (Chip-on-wafer) Equipment - Bumping

Responsibilities: To manage, operate, and maintain all core process equipment and associated utility interfaces to ensure maximum tool availability and operational stability. To execute routine preventive maintenance (PM), drive rapid breakdown troubleshooting, and lead tool qualification/hook-up for line equipment

• Tool Hook-up, Setup & New Equipment Qualification
• Equipment OEE Optimization & Spare Parts Management
• Equipment Vendor Technical Management, Tool Specification Review & Escalation Handling

Requirements:

• Bachelor’s degree in Mechanical Engineering, Electrical/Electronic Engineering, Material Science, or related engineering disciplines (or Diploma with equivalent extensive industry experience)
• R&D or mass production experience of at least eight years in semiconductor equipment engineering
• Proven track record in equipment setup, utility hook-up (vacuum, CDA, ultra-pure water, specialty gases), and tool qualification for mass production/R&D
• Strong capability in vendor management, negotiating tool specifications, and driving vendor technical support for new equipment qualification
• Excellent problem-solving skills in equipment failure analysis (FA), OEE improvement, and cross-functional collaboration with process and utility teams