Mechanical Engineer: Micro-Transfer Printing and Precision Micro-Assembly Tools

Mechanical Engineer: Micro-Transfer Printing and Precision Micro-Assembly Tools

About us

We are a venture-backed deep-technology company in Singapore building photonic interconnect technology for AI compute. Our team integrates high-speed photonic devices into advanced semiconductor packages using precision micro-assembly, and we are building the tools that make this possible at scale. We are a small, senior, hands-on team with strong backing and a clear roadmap; you will see the direct impact of your work on real hardware every week.

The role

You will own the mechanical engineering of our micro-transfer printing (MTP) and precision micro-assembly tool platform, from print-module mechanics and motion systems through to fixtures, vacuum and thermal subsystems, and you will run those tools day to day to transfer photonic devices with micron-level precision. This is a builder's role: design it, build it, bring it up, measure it, improve it.

What you will do

• Design, build and commission mechanical subsystems for MTP and micro-assembly tools: print-module and stamp mechanics, precision stages and kinematic mounts, substrate and source-wafer fixturing, vacuum, pneumatic and thermal subsystems, alignment-optics mounting.
• Operate and maintain MTP tools in the lab: tool bring-up, calibration, preventive maintenance, troubleshooting and uptime.
• Run structured experiments on transfer yield and placement accuracy; analyse data; feed findings back into tool and process design.
• Perform tolerance analysis, GD&T, FEA (static, thermal, modal) and design-for-manufacture on precision assemblies.
• Specify, source and qualify components and subsystems (stages, actuators, vacuum, optics mounts, sensors); manage machine shops and vendors.
• Document designs, procedures and results to a standard that supports technology transfer and manufacturing scale-up.
• Work closely with photonics, process and integration engineers; contribute to safety, cleanroom and equipment protocols.

What you bring

• Bachelor's degree in Mechanical, Mechatronics, Precision or Manufacturing Engineering (Master's a plus).
• At least 2 years' hands-on experience with micro-transfer printing tools, or equivalent precision die-transfer or micro-assembly equipment, used on photonic or semiconductor devices: for example elastomer-stamp transfer printing, mass-transfer tools, die or flip-chip bonders, wafer bonders, or high-precision pick-and-place with micron-class placement accuracy.
• Strong precision-mechanism fundamentals: kinematics, flexures, stiffness and thermal stability, motion-stage selection and integration.
• Proficiency in 3D CAD (SolidWorks, Creo or equivalent), GD&T and tolerance stack-up; working FEA skills.
• Hands-on with vacuum and pneumatic systems, precision fixturing and alignment; comfortable in a cleanroom.
• Data-driven: design of experiments, measurement and analysis (Python, MATLAB or similar).
• Clear written documentation and an ownership mindset in a fast-moving, small-team environment.

Nice to have

• Experience with elastomer (e.g. PDMS) stamps and stamp fabrication; microLED or photonic die mass transfer.
• Photonics or optoelectronics packaging: fibre or laser attach, active alignment, micro-optics assembly.
• Machine vision and alignment systems; motion-control programming (e.g. LabVIEW, Python, PLC).
• Equipment design to SEMI or ISO cleanroom standards; vacuum chuck and thermal-head design.
• Experience taking lab tools toward production-grade equipment.

What we offer

• Competitive salary
• Direct exposure to a senior team of photonics, semiconductor and packaging engineers.
• Singapore-based role; we support work-pass applications for qualified international candidates.

How to apply

Upload your CV and a short note on the precision tools you have personally built, operated or improved to the application portal. We review every application and respond to all shortlisted candidates.

We are an equal-opportunity employer and consider all candidates fairly on merit, in line with the Tripartite Guidelines on Fair Employment Practices.