Semicon Wafer Bumping Equipment Senior/ Engineer

Job Summary:

Responsible for maintaining, troubleshooting, and optimizing wafer bumping equipment toensure high equipment uptime, stable production, and good yield.

Key Responsibilities:

• Install,qualify, maintain, and troubleshoot wafer bumping equipment.
• Support equipment such as plating, PVD/sputtering, lithography, cleaning, stripping,and reflow systems.
• Perform preventive/corrective maintenance and root-cause analysis.
• Improveequipment uptime, OEE, MTBF, and MTTR.
• Supportnew equipment installation, upgrades, and production ramp-up.
• Work with process engineers and vendors to resolve equipment/process issues.
• Maintain equipment documentation and safety standards.

Requirements:

• Degree in Engineering or related field.
• 2–5years of equipment such as plating, PVD/sputtering, lithography, cleaning,stripping, and reflow systems equipmentengineering experience preferred.
• Experience in wafer bumping or semiconductor backend/advanced packaging is an advantage.
• Strong mechanical/electrical troubleshooting and problem-solving skills.
• Good communication and teamwork skills.

All Successful candidates can expect a very competitive remuneration package and acomprehensive range of benefits.

Please email your resume in a detailed MS Word format to joyce@peopleprofilers.com stating

1)Current Drawn 2)Expecting Salary 3)Date Available 4)Reason to Leave each job:

Weregret that only shortlisted candidates will be notified

JoyceKoh Ai Leng PeopleProfilers Pte Ltd 20Cecil St, #08-09, PLUS Building, Singapore 049705 Tel:6950 9737 www.peopleprofilers.com EA License Number: 02C4944 EA Personnel Reg nos R1110618 Job ID: JOB-01077