Principal Packaging Engineer, Optical Interfaces

Key Responsibilities

Process Design & Development:

• Design and develop robust, high-yield processes for active and passive optical interfaces to photonic integrated circuits (PICs).
• Specialize in using advanced methods to achieve stable and reliable fiber coupling. This includes selecting appropriate materials and controlling critical parameters.
• Collaborate with IC and mechanical design teams to define and create structures that minimize stress, ensure thermal stability, and enhance the overall reliability of the package.

Manufacturing & Collaboration:

• Act as the key technical interface with our contract manufacturing partners, coordinating process design, implementation, and characterization to ensure a smooth transition from development to high-volume production.
• Define and manage critical process controls, alignment tolerances, and metrology methods to ensure consistent, high-performance output in a manufacturing environment.
• Conduct in-depth analysis of assembly and packaging yield data to drive continuous process improvement.

Reliability & Performance:

• Define and implement test methodologies to characterize the reliability of packaged devices under various environmental and mechanical stresses.
• Analyze reliability data to identify potential failure modes and work with design teams to implement corrective actions.
• Utilize your understanding of thermal, modal, and stress/strain principles to predict and mitigate reliability risks associated with packaging.

Minimum Qualifications

• Bachelor's, Master's, or Ph.D. in Mechanical Engineering, Materials Science, Optical Engineering, or a related field.
• 10+ years of hands-on experience in packaging design for optical or photonic components.
• Direct experience with PIC optical edge coupling and associated challenges, including proficiency with active and passive alignment techniques.
• Direct product development and introduction experience involving edge coupling.
• In-depth knowledge of packaging materials, including optical adhesives and epoxies, and their design constraints, and how to use them in a high reliability application.
• Proven ability to work with contract manufacturers to design, implement, and ramp packaging processes to volume production.
• A strong understanding of reliability engineering principles, including failure mechanisms related to packaging, and experience with relevant testing standards (e.g., Telcordia).
• Experience with CAD tools for mechanical design and packaging layouts.

Preferred Skills

• Familiarity with various waveguide technologies and their impact on packaging design.
• Knowledge of semiconductor fabrication processes and their constraints on packaging.
• Experience with Finite Element Analysis (FEA) software for stress, thermal, or modal simulations.
• Excellent problem-solving skills and a track record of driving complex technical challenges from concept to solution.
• Strong communication and collaboration skills, with the ability to work effectively across interdisciplinary teams.