Advanced Packaging Engineer

Photonics Advanced Packaging Engineer Holst Centre

Eindhoven, Netherlands Posted on Jul 29, 2026

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Photonics Advanced Packaging Engineer

What you will do

As a Photonics advanced packaging engineer , you will contribute to developing photonic solutions for a wide range of different research projects including Laser, Hybrid integration, LiDAR, Co-Packaged Optics, Datacom, and Biosensors. This starts with identifying and enabling photonic packaging paths for integrated photonics in collaboration with internal and external partners. With these packaging paths, you manage efficient operation of the packaging processes and develop next-generation photonics packaging technologies. You will be part of our interdisciplinary team. In this position, you will have a key and visible role in this initiative. Your main tasks will be:

• Lead the development of laser integration and packaging solutions for integrated photonics, with a strong focus on III-V to Silicon (Silicon Nitride) packaging strategies.
• Own and manage established packaging workflows in close collaboration with internal teams and external partners
• Build new packaging paths for operational excellence and new demands.
• Establish and improve design-for-packaging (DfP) guidelines covering optical, electrical, and thermal aspects.
• Develop next-generation packaging and integration technologies for emerging applications.
• Define and evaluate packaging architecture options, including trade-offs in performance, cost, and manufacturability.
• Take the ownership of planning, scheduling, and execution of packaging campaigns as well as performance and yield analysis.
• Demonstration and validation of packaged chips in a lab environment.
• Share insights and experiences with the team and contribute to the development and maturity of packaging.
• Prepare technical notes and documentation for internal and external customers.
• Optionally, file patents or publish your work.

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