SENIOR PDE (PACKAGE DEVELOPMENT ENGINEERING) CENTRAL YE ENGINEER
As a PDE Central Yield Enhancement (YE) Engineer within Package Development Engineering (PDE), you will own and execute yield learning and improvement activities across advanced package technologies during HBM and NCG New Product Introduction (NPI). Your scope includes yield monitoring, excursion response, and yield stabilization, with an emphasis on rapid learning, early risk identification, and scalable solutions. This role plays a key part in driving robust yield performance from first silicon through NPI ramp and early HVM, partnering closely with Process Integration (PI), MRDA, Process Engineering, Assembly/Test Manufacturing and Quality teams. You will act as a hands‑on yield owner for NPI builds, translating data into actionable insights, driving fast learning cycles, early risk detection, and leading disciplined yield recovery. Job Responsibilities Yield Loss Accounted For Account for HBM NPI builds across PWF, Assembly, and test through defect breakdown and PFA submission to understand fail mode
Own and execute assigned Central YE responsibilities for HBM NPI program, work closely with PI to identify defects that is coming from their area to brainstorm for CIP
Learn NPI processes, phase gates, and yield best practices
Assist in maintaining yield dashboards and trackers. Support PI/PE/RDA in identifying and transforming processing data to account/ breakdown a yield loss
Yield Deviation Control Analyze and report on yield deviation issue and trigger action from PI, PE or RDA
Support block run and partial conversion build yield analysis to early detect any impact on yield
Work closely with PCS team to identify SPC or FDC charts to put into YLR dashboard for shift left monitoring
Yield Improvement Opportunities Brainstorm with staff from other departments for improvement opportunities and propose to PI
Design and implement new solutions, including hotspot analytics, to improve the effectiveness of the automated defense line system.
Utilize software tool like Auto-diagnostics to find yield improvement opportunities
Integrating Artificial Intelligence Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgement and complying with organizational standards and legal requirements
Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work
Job Requirements Bachelor's or Master's degree in Electrical/ Electronics Engineering/ Computer Engineering / Computer Science with 2 to 5 years of experience in semiconductor industry, specifically involving yield analysis, defect/root cause investigation, or data-driven process optimization in advanced memory (HBM, DRAM, NAND) or high-volume semiconductor packaging.
Proficiency in Python (e.g., Pandas, NumPy) and SQL for semiconductor manufacturing data analysis, with hands-on experience developing interactive dashboards and visual reports using tools (including Spotfire and Power BI/Tableau) to translate large manufacturing datasets into actionable yield and process improvement insights.
Demonstrated experience building automated reporting workflows, data pipelines, or process automation solutions using Python scripting or RPA tools within a semiconductor manufacturing environment, with the ability to drive cross-functional decisions across manufacturing, process integration, and engineering teams in the semiconductor industry.
Ability to apply baseline digital fluency and role-appropriate AI literacy to use AI-enabled tools responsibly and effectively for research, analysis, content creation, problem-solving, operational tasks, and achieving business outcomes
Embody Micron’s Core Values People – Respect, develop, and empower others.
Innovation – Drive continuous improvement and breakthrough thinking.
Tenacity – Show grit and determination.
Collaboration – Build trust and foster teamwork.
Customer Focus – Deliver excellence and value