Principal System/Rack Mechanical Engineer

Astera Labs (NASDAQ: ALAB) provides rack-scale AI infrastructure through purpose-built connectivity solutions. By collaborating with hyperscalers and ecosystem partners, Astera Labs enables organizations to unlock the full potential of modern AI. Astera Labs’ Intelligent Connectivity Platform integrates CXL®, Ethernet, NVLink, PCIe®, and UALink™ semiconductor-based technologies with the company’s COSMOS software suite to unify diverse components into cohesive, flexible systems that deliver end-to-end scale-up, and scale-out connectivity. The company’s custom connectivity solutions business complements its standards-based portfolio, enabling customers to deploy tailored architectures to meet their unique infrastructure requirements. Discover more at www.asteralabs.com .

Senior Principal Mechanical Engineer

Location: Research Triangle Park (RTP), North Carolina Department: Hardware Engineering / System Architecture Employment Type: Full-Time

We are seeking a Senior Principal Mechanical Engineer to lead mechanical architecture and system integration across next-generation AI platforms, optical networking systems, and rack-scale infrastructure solutions.

The Opportunity

This is a highly visible leadership role responsible for developing mechanical architecture across:

PCIe Scale-Up AI Infrastructure

UALink Rack-Scale Fabrics

Ethernet Scale-Out Systems

ESUN Network Architectures

GPU Compute Platforms

Open Rack Systems

Fiber Connectivity Infrastructure

NPO (Near Package Optics)

CPO (Co-Packaged Optics)

Air-Cooled and Liquid-Cooled AI Platforms

You will work closely with Thermal, Power, Electrical, Silicon, Software, and System Architecture teams, as well as ODM partners including Accton, Hyve, Wistron, Quanta, and Gigabyte.

What You'll Do

Lead Mechanical Architecture for AI Platforms

Define mechanical architecture from device-level products through complete rack-scale AI systems.

Develop scalable mechanical designs supporting future generations of AI infrastructure.

Establish system-level design requirements balancing:

Performance

Reliability

Manufacturability

Serviceability

Cost

Sustainability

Design Rack-Scale AI Infrastructure

Own mechanical architecture for:

GPU Compute Platforms

PCIe Scale-Up Switch Platforms

UALink Switch Platforms

Optical Connectivity Systems

Rack Controllers

Rack Enclosures

Cable Management Systems

Open Rack Platforms

Drive solutions that support high-density AI computing deployments.

Develop Open Rack and Rack-Level Mechanical Solutions

Define rack layouts and mechanical interfaces.

Develop scalable rack architecture standards.

Drive mechanical integration of:

Compute systems

Switch platforms

Power shelves

Cooling infrastructure

Optical connectivity

Management systems

Support future multi-rack AI factory deployments.

Enable Fiber Connectivity and Optical Systems

Develop mechanical solutions supporting:

Fiber Infrastructure

Optical Engines

Silicon Photonics

NPO Architectures

CPO Architectures

Rack-to-Rack Optical Connectivity

Address challenges associated with:

Cable routing

Bend radius management

Serviceability

Fiber protection

Field replaceability

Support Air-Cooled and Liquid-Cooled Systems

Partner with Thermal Engineering teams to:

Optimize airflow architecture.

Develop liquid cooling mechanical solutions.

Support cold plate integration.

Define coolant distribution infrastructure.

Improve overall system cooling efficiency.

Drive Mechanical Design for Manufacturability

Define manufacturing-ready mechanical solutions.

Support supplier and ODM engagement.

Drive cost optimization efforts.

Establish assembly and service procedures.

Improve production scalability and operational efficiency.

Lead System Integration Activities

Work closely with:

Electrical Engineering

Thermal Engineering

Power Architecture

Silicon Development

Product Management

Manufacturing Teams

to ensure complete system integration and design alignment.

Collaborate with ODM Partners

Work directly with Accton, Hyve, Wistron, Quanta, Gigabyte, and other ODMs to:

Define mechanical requirements.

Review platform designs.

Resolve integration challenges.

Drive Open Rack implementation.

Support design validation and manufacturing readiness.

Required Qualifications

Bachelor's, Master's, or PhD in Mechanical Engineering or related discipline.

15+ years of experience in mechanical design and system integration.

Proven experience leading mechanical architecture for:

Servers

Networking Platforms

Storage Systems

AI Infrastructure

Data Center Hardware

Expertise in:

Sheet Metal Design

Structural Analysis

Tolerance Analysis

Mechanical Packaging

Cable Management

System Integration

Design for Manufacturing (DFM)

Design for Assembly (DFA)

Preferred Qualifications

Experience with Open Rack and OCP architectures.

Experience supporting rack-scale AI infrastructure.

Familiarity with PCIe Scale-Up and UALink architectures.

Experience with Ethernet and optical networking systems.

Knowledge of fiber connectivity solutions and optical packaging.

Experience supporting NPO and CPO platforms.

Experience developing liquid-cooled infrastructure.

Experience working directly with ODM/JDM manufacturing partners.

Leadership Attributes

The ideal candidate will demonstrate:

Strong systems thinking

Strategic technical leadership

Cross-functional influence

Excellent communication skills

Ability to drive architecture decisions across multiple organizations

Passion for solving complex AI infrastructure challenges

Why Join Astera Labs?

You will help define the mechanical architecture for next-generation technologies including:

PCIe Scale-Up AI Fabrics

UALink Scale-Up Networks

Ethernet Scale-Out Infrastructure

ESUN Network Architectures

NPO and CPO Optical Platforms

Advanced Fiber Connectivity Solutions

Open Rack AI Systems

Future AI Factory Deployments

This is an opportunity to drive the mechanical design of industry-leading products that power the world's largest AI clusters.

Apply Today

If you are passionate about mechanical innovation, rack-scale infrastructure, optical connectivity, and next-generation AI systems, we'd love to hear from you.

The salary range is $170,000 to $210,000, depending on experience, level, and business needs. This role may be eligible for discretionary bonuses, incentives, and benefits.

Join us in Research Triangle Park and help build the future of AI infrastructure. We know that creativity and innovation happen more often when teams include diverse ideas, backgrounds, and experiences, and we actively encourage everyone with relevant experience to apply, including people of color, LGBTQ+ and non-binary people, veterans, parents, and individuals with disabilities.